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UV Point Light Source Irradiation Head 365nm
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Shipping: US-Mainland: free (more destinations)
Condition: Brand new
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1.UV Point Light Source Irradiation Head 365nm Parameters:
Spot Diameter: 6mm
Recommended Irradiation Distance: 17mm
365nm Peak (Irradiation Intensity) : 3600mW/CM2
2.Product Description:
Length of Spot Light: 84mm
Usage: connect the power supply and plug to use
Cooling: Nature cooling
Net Weight: about 1000g ( with power supply and plug )
Wavelength: 365nm
Output current: 700mA/channel
Working temperature: 10℃~50℃
Storage temperature: -10℃~65℃
3.Applications:
Research - photocatalysis, light excitation, photosynthesis and various scientific experiments. Optical Industry - cemented lens and lens groups, prisms, optical engine assembly; microscopes, endoscopes, infrared instrument, night vision equipment, the probe assembly. Optical communications industry - passive devices (various structural bonding or potting glass package tiny element fixed) bonding. Active devices (coaxial devices, laser collimator) bonding. Microelectronics and semiconductor industry -LEC liquid potting Pin FPC adhesively fixed, sensor production, handset components assembly, hard drive head assembly, motors and components assembly, components (capacitors, inductors, a variety of plug-ins, screws, chips, etc.) precision electronics manufacturing. Medical industry - a variety of catheters and instruments of precision adhesive bonding.
Spot Diameter: 6mm
Recommended Irradiation Distance: 17mm
365nm Peak (Irradiation Intensity) : 3600mW/CM2
2.Product Description:
Length of Spot Light: 84mm
Usage: connect the power supply and plug to use
Cooling: Nature cooling
Net Weight: about 1000g ( with power supply and plug )
Wavelength: 365nm
Output current: 700mA/channel
Working temperature: 10℃~50℃
Storage temperature: -10℃~65℃
3.Applications:
Research - photocatalysis, light excitation, photosynthesis and various scientific experiments. Optical Industry - cemented lens and lens groups, prisms, optical engine assembly; microscopes, endoscopes, infrared instrument, night vision equipment, the probe assembly. Optical communications industry - passive devices (various structural bonding or potting glass package tiny element fixed) bonding. Active devices (coaxial devices, laser collimator) bonding. Microelectronics and semiconductor industry -LEC liquid potting Pin FPC adhesively fixed, sensor production, handset components assembly, hard drive head assembly, motors and components assembly, components (capacitors, inductors, a variety of plug-ins, screws, chips, etc.) precision electronics manufacturing. Medical industry - a variety of catheters and instruments of precision adhesive bonding.
CN, Guangdong
